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TLC-2H26

Laser Processing Equipment for Semiconductor Applicaion

CO2 Laser Drilling Machine TLC-2H26

TLC-2H26 adopted the new high power laser and high speed galvanometer to increase processing speed significantly. The reliable mechanical structure of laser drilling machine developed by using the mechanical design experience can achieve the long time mass production requirement. Using stable high power laser in combination with high speed galvano system dramatically improve processing efficient. On average, the output of laser power is over 350W. Simple HMI (Human Machine Interface) and operation panel can be enabled auto-processing by using start button. In the mass production processing, the start button enable running the auto-processing while the parameter setting and loading the processing file. TLC-2H26 laser drilling machine developed with a new laser and original optical system to improve processing performance significantly. As a result, TLC-2H26 supports a variety of processing for different materials and production stages.


Specification

Item Unit TLC-2H26
Laser type form   9.4 um CO2 Laser
Laser power W 300
Scan range mm 65x65 (Opt. 25x25/50x50)
Scope of work mm 660x813 x2panels (26''x32'')
XY axis moving speed m/min 50
Air pressure kg/cm2 6~7
Air consumption L/min 1200
Dimensions (LxWxH) (Loading and unloading) mm 4649x2180x1850 Including signal height 2250mm
Controller   PC Based

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