Home > Products > Laser Equipment > Laser Processing Equipment for Semiconductor Applicaion > Laser Drilling Machine > CO2/UV Hybrid laser Processing Machine TLCU-660 Home > Products > Laser Equipment > Laser Processing Equipment for Semiconductor Applicaion > Laser Drilling Machine > CO2/UV Hybrid laser Processing Machine TLCU-660 TLCU-660 is an economical, high-productivity machine with a highly rigid machine structure. It has Hole-by-hole function – Full inspection of hole deviation to assist user to control the status of the entire machine to ensure stable processing quality. To detailed information that can help user to clarify the problems in the production process. In addition, it provide Skive function (laser ablation registration hole) to solve the coarctation problem of multi-layer board. Normally, the visual psitioning catures the outermost pattern to make corrections. However, the multi-layer board will have deviation and deformation during the bonding process. This reduces the accuracy of the outermost pattern. Go through the Skive function to directly captures the inner layer pattern, which provides more accurate compensation.
| Item | Unit | TLCU-660 | |
| Laser type form | um | 9.4um CO2 Laser | 355 um UV Laser |
| Laser power | W | >300W | 20W@90kHz |
| Operating frequency | kHz | 1~5 | 50~300 |
| Scan range | mm | 50x50 | 46x46 (Opt. 35x35) |
| Scope of work | mm | 660x813 (26''x32'') | |
| XY axis moving speed | m/min | 50m/min | |
| Air pressure | kg/cm2 | 7 | |
| Air consumption | L/min | <800 | |
| Dimensions (LxWxH) | mm | 2300x2180x1960 | |
| Controller | PC Based | ||
