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Laser Processing Equipment for Semiconductor Applicaion

CO2/UV Hybrid laser Processing Machine

TLCU-660 is an economical, high-productivity machine with a highly rigid machine structure. It has Hole-by-hole function – Full inspection of hole deviation to assist user to control the status of the entire machine to ensure stable processing quality. To detailed information that can help user to clarify the problems in the production process. In addition, it provide Skive function (laser ablation registration hole) to solve the coarctation problem of multi-layer board. Normally, the visual psitioning catures the outermost pattern to make corrections. However, the multi-layer board will have deviation and deformation during the bonding process. This reduces the accuracy of the outermost pattern. Go through the Skive function to directly captures the inner layer pattern, which provides more accurate compensation.


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