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Electronic Material Processing

Flip Drilling

Feature :

  • Extra large aspect ratio
  • Minimum overlap



  • High speed communications
  • IC test socket 

CO2 Laser


  • High-speed digital scanning galvanometer (ensure long-term drilling accuracy)
  • Stabilized spectroscopic system (improved production efficiency)



  • Browning oxide treatment process drilling
  • Black oxide treatment process drilling
  • Wafer drilling

UV/CO2 Composite Laser


  • Composite laser (meet the processing of metal and non-metal materials)
  • Avoid secondary alignment (reduce alignment machining errors)



  • Roger 3003 Drilling
  • Second-order blind hole process
  • Removal of residues after CO2 laser drilling - UV clean
  • BGA substrate cutting



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