Home > Products > Laser Equipment > Laser Processing Equipment for Semiconductor Applicaion > Laser Drilling Machine > CO2 Laser Drilling Machine TLC-2H22Ⅲ Home > Products > Laser Equipment > Laser Processing Equipment for Semiconductor Applicaion > Laser Drilling Machine > CO2 Laser Drilling Machine TLC-2H22Ⅲ TLC-2H22Ⅲ has superior stability, new laser optical system and digital scanning system greatly improve drilling accuracy and stability, especially for advanced IC packaging processing. We have increased the utilization of equipment, the machine can be modified per costumer′s product sizes, including wafer, frame, and panel types. It also multiple types of panels supporting. Adapt new type of CO2 laser, reduce equipment operating cost and increase production efficiency. It has EFEM loading system module expansion, including SECS/GEM functionally, support Industry 4.0 standard. As well, we provides English/Chinese interface which is free conversion software to current production programs. (Other companies charge such software)
| Item | Unit | TLC-2H22III |
| Laser type form | 9.4 um CO2 Laser | |
| Laser power | W | 300 |
| Scan range | mm | 65x65 (Opt. 25x25/50x50) |
| Scope of work | mm | 560x690 x2panels (22''x27'') |
| XY axis moving speed | m/min | 50 |
| Air pressure | kg/cm2 | 6~7 |
| Air consumption | L/min | 1200 |
| Dimensions (LxWxH) (Loading and unloading) | mm | 4079x2100x1850 Including signal height 2250mm |
| Controller | PC Based |
