Home > Products > Laser Equipment > Ultra-fast Laser Processing Equipment > Lasrt Cutting Machine > Femtosecond Laser Processing Machine TLFS-500Home > Products > Laser Equipment > Ultra-fast Laser Processing Equipment > Lasrt Cutting Machine > Femtosecond Laser Processing Machine TLFS-500TLFS-500 is mainly used for Si wafer cutting and molding compound drilling of the wafer packaging process in the semiconductor industry. Use the UV laser source to focus on the surface of the work piece to ablate and remove the material, and then cooperate with the CNC computer system to control the movement of the machine and the scanning head, control the laser focus position, and achieve Si material cutting on wafer materials and Molding Compound material drilling.
| Item | Unit | TLFS-500 |
| Laser type form | Femtosecond Ultrafast Laser | |
| Laser power | W/kHz | >15W@375MHz |
| Operating frequency | kHz | 200, 400 or 1000 |
| Scan range | mm | 50x50 |
| Scope of work | mm | 500x500 (20''x20'') |
| XY axis moving speed | m/min | 30 |
| Air pressure | kg/cm2 | 6~7 |
| Air consumption | L/min | 1000 |
| Dimensions (LxWxH) | mm | 1430x2180x1435 |
| Controller | PC Based |
