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Ultra-fast Laser Processing Equipment

Nanosecond Ultrafast Laser Processing Machine TLU-500

It is mainly used for Si wafer cutting and molding compound drilling of the wafer packaging process in the semiconductor industry. Use the UV laser source to focus on the surface of the work piece to ablate and remove the material, and then cooperate with the CNC computer system to control the movement of the machine and the scanning head, control the laser focus position, and achieve Si material cutting on wafer materials and Molding Compound material drilling.


Item Unit TLU-500
Laser type form   355nm UV
Laser power W/kHz 20W@90kHz
Operating frequency kHz 50~300
Scan range mm 50x50
Scope of work mm 500x500 (20''x20'')
XY axis moving speed m/min 50
Air pressure kg/cm2 6~7
Air consumption L/min <800
Dimensions (LxWxH) mm 1430x2180x1435
Controller   PC Based

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