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Ultra-fast Laser Processing Equipment

Picosecond Laser Processing Machine

TLPS-500 is mainly used for Si wafer cutting and molding compound drilling of the wafer packaging process in the semiconductor industry. Use the UV laser source to focus on the surface of the work piece to ablate and remove the material, and then cooperate with the CNC computer system to control the movement of the machine and the scanning head, control the laser focus position, and achieve Si material cutting on wafer materials and Molding Compound material drilling.


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