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Laser Processing Equipment

CO2 Laser Drilling Machine

TLC-2H22Ⅲ has superior stability, new laser optical system and digital scanning system greatly improve drilling accuracy and stability, especially for advanced IC packaging processing. We have increased the utilization of equipment, the machine can be modified per costumer′s product sizes, including wafer, frame, and panel types. It also multiple types of panels supporting. Adapt new type of CO2 laser, reduce equipment operating cost and increase production efficiency. It has EFEM loading system module expansion, including SECS/GEM functionally, support Industry 4.0 standard. As well, we provides English/Chinese interface which is free conversion software to current production programs. (Other companies charge such software)


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