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Electronic Material Processing

High-Precision Engraving

Feature:         

  • Multi-material processing (glass substrate, aluminum substrate, epoxy resin material)
  • Automatic correction of rotation angle error
  • Real-time monitoring of laser power
  • X-free function (to solve the problem of excessive energy at the junction of lettering strokes)

 

Application:

  • PCB Panel, Silicon Wafer and Wafer engraving
  • Notch cut
  • SEMI M12 single point/dual point
  • QR Code engraving
  • Molding Slot hole

Videos

 

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