Tongtai Seizes Semiconductor Business Opportunities

Tongtai Machine & Tool Co., Ltd. (4526) is actively expanding its presence in the semiconductor industry. Today, the company participates in SEMICON Taiwan 2024 (Booth number N-0662), showcasing its latest "Wafer Planarization Solutions" and launching a new single-axis wafer thinning machine. Over the next 3 to 5 years, the company aims for the semiconductor sector to contribute 50% of the revenue of its Electronics Business Unit.

The single-axis wafer thinning machine from Tongtai is designed with the user in mind. It features a self-developed, stable, and consumable-free hydrostatic spindle and worktable drive technology. This design effectively addresses wear issues, maintains high stability during processing, and ensures precise displacement. It is particularly suited for processing third-generation semiconductor silicon carbide wafers and other hard and brittle materials. Tongtai's in-house developed Human-Machine Interface (HMI) offers not just user-friendly operation, but also comprehensive functionality, and high software customization flexibility to meet diverse customer needs. The machine is currently on display at Tongtai's headquarters in Luzhu, Taiwan, where customers are invited to view and test the equipment.

Tongtai's strategic collaboration with Japan's Dry Chemical (DC) company, announced at the exhibition, is set to bring significant benefits to customers. DC, a Japanese company specializing in wafer processing, provides critical solutions for material handling in semiconductor manufacturing processes, helping to reduce process costs and improve production efficiency. Tongtai's equipment, combined with DC's technology, will jointly offer customers a "Revolutionary Wafer Processing Technology" that shortens wafer processing time and reduces the cost of using CMP processes.

Tongtai's recent partnership with a leading European semiconductor equipment company is a testament to its commitment to technological innovation and market growth. This collaboration is expected to bring about significant advancements in the semiconductor industry. Related product validation has been completed, and further business opportunities are expected to continue developing.