Tongtai exhibits multiple technologies in 2018 China Int’l PCB & Assembly Show in Shanghai! The drilling manufacturing process - for multi axis with big table machine, and laser drilling machine which can choose the light source (CO2/UV/pico-laser) for different types of material; the forming manufacturing process - for the machine with multi axis and available for different board’s size, and the advanced laser processing technology - 3D packaging manufacturing process which is especially appropriate for semiconductor. Still need to know other information? Welcome to leave messages to us!